Copper deposition on metallic and non?metallic single particles via impact electrochemistry

This study demonstrates the possibility of depositing metals onto low-metal content particles via impact electrochemistry, a technique used to measure transient current signals (electrochemical impacts) produced from collision between moving under Brownian motion and potentiostated interface (Rees, 2014; Markham et al., 2020; Zhang Zhou, 2020). The deposition copper surface fly-ash cenospheres electrochemical impacts is reported, along with its silver gold nanoparticles. A comparison linear sweep voltammetry confirmed that correlated potentials (bulk underpotential deposition). Reductive events were observed at negative ?0.3 V (for Ag) ?0.1 Au) (vs. MSE), evidence for change in coverage ca. 103% 261% ?0.8 vs. MSE Au. Cenospheres shown be sufficiently electrochemically active facilitate deposition, either on modified electrodes or showing spikes indicating which was SEM/EDX ICP-MS analysis.